ISO 9455-17:2002
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
Reference number
ISO 9455-17:2002
Edición 1
2002-12
Retirada
ISO 9455-17:2002
32830
Retirada (Edición 1, 2002)

Resumen

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

Informaciones generales

  •  : Retirada
     : 2002-12
    : Retirada de la Norma Internacional [95.99]
  •  : 1
     : 21
  • ISO/TC 44/SC 12
    25.160.50 
  • RSS actualizaciones

Ciclo de vida

¿Tiene alguna duda?

Consulte nuestras Ayuda y asistencia