This part of ISO 9455 specifies test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.
Status: Under development
Technical Committee: ISO/TC 44/SC 12 Soldering materials
- ICS :
This standard contributes to the following Sustainable Development Goal:
ISO/AWI 9455-18Stage: 20.00
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